Reducing edge effect of temperature-field for large area thin film deposition in hot filament chemical vapor deposition system

Lin Li1, 3, Shibing Tian1, 3, Ruhao Pan1, 3, Chao Wang1, 3, Chi Sun1, 3, Junjie Li1, 3*, Changzhi Gu1, 2, 3*

1Beijing National Laboratory for Condensed Matter Physics, Institution of Physics Chinese Academy of Sciences, Beijing 100190, China

2Collaborative Innovation Center of Quantum Matter, Beijing, 100190, China

3School of Physical Sciences, CAS Key Laboratory of Vacuum Physics, University of Chinese Academy of Sciences, Beijing 100190, China

Adv. Mater. Lett., 2018, 9 (10), pp 727-732

DOI: 10.5185/amlett.2018.2146

Publication Date (Web): Jul 18, 2018



The uniformity in temperature-field of the hot filament chemical vapor deposition (HFCVD) system is of great importance since it is a critical parameter that determines the quality of the deposited films. In fact, the temperature-field is mainly filament distribution dependent. In conventional analysis method, the filament array usually has an equal-space distribution, which leads to a remarkable edge effect and consequently unable to obtain large area uniformity in temperature-field in HFCVD for high-quality thin film deposition. Here, we proposed theoretically an asymmetrical filament distribution to reduce the edge-effect of temperature field. The adjacent filament distance was optimized by using numerical simulation based on heat-transfer theory. Based the optimized condition, temperature difference as low as 13 K between the center and edge region of the filament arrays can be achieved in 100-mm substrate, which is only one tenth of the temperature difference of that in the case that the filaments were evenly distributed. Thus unequal-space distribution can be employed to enhance the uniformity in temperature field of the HFVCD system in favor of the growth of high quality thin films in large area.


Hot filament, chemical vapor deposition, temperature-field, thin film.

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