Characterization of a New Copper Paste for Printed Electronics

Ihssan Hendi,* Matthieu Blaise, Gaétan Schneider, Manuel Fendler

CEA Tech, 5 rue Marconi, Metz Technopole, 57070 METZ, France

Adv. Mater. Lett., 2020, 11 (6), 20061523

DOI: 10.5185/amlett.2020.061523

Publication Date (Web): Mar 14, 2020

E-mail: ihssan.hendi@cea.fr

Abstract


Printed electronics can be considered as an additive manufacturing technique allowing the fabrication of circuits and devices such as sensors, MEMS, LEDs, etc. An important research subject in this field is identifying new materials exhibiting low resistivity. In this article, we present a new copper paste interesting for structural electronics, based on additive manufacturing and laser activation. We characterized the structure of this copper paste after laser activation, by SEM, EDS, and FTIR. We also used four probe method to characterize sheet resistance to obtain a resistivity as low as 10-7 .m, and compared it to other commercial conductive pastes.

Keywords

Copper conductive paste, laser activation, structural electronics, additive manufacturing.

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